发明名称 |
FUNCTIONAL PARTICLE GROUP, FILLER, RESIN COMPOSITION FOR ELECTRONIC PART, ELECTRONIC PART, AND SEMICONDUCTOR DEVICE |
摘要 |
<P>PROBLEM TO BE SOLVED: To stably hold a curable resin, a curing agent and a curing accelerator on the base material particles in a predetermined formulation. <P>SOLUTION: The functional particle group 130 includes a first particle 131 having an inorganic particle 111 and a first layer 113, and a second particle 121 having the inorganic particle 111 and a second layer 123. Any one or two components among the curable resin (A), the curing agent (B) and the curing accelerator (C) are contained in the first layer 113, while the other component(s) is contained in the second layer 123. <P>COPYRIGHT: (C)2012,JPO&INPIT |
申请公布号 |
JP2012052087(A) |
申请公布日期 |
2012.03.15 |
申请号 |
JP20110045730 |
申请日期 |
2011.03.02 |
申请人 |
SUMITOMO BAKELITE CO LTD |
发明人 |
KAWAGUCHI TATSUMI;NAKANO SHOGO;OZASA KOREYOSHI |
分类号 |
C08L101/00;C01B33/18;C08K3/00;H01L23/29;H01L23/31 |
主分类号 |
C08L101/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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