发明名称 |
HEAT DISSIPATION HOUSING, LITHIUM BATTERY PACK USING THE SAME, AND SEMICONDUCTIVE TAPE FOR HEAT DISSIPATION |
摘要 |
<P>PROBLEM TO BE SOLVED: To provide a heat dissipation housing which is capable of achieving high heat-dissipation/cooling effects. <P>SOLUTION: A heat dissipation housing 1 of the present invention comprises a metallic housing body 11 and a first semiconductive tape 12 for heat dissipation which is stuck to at least a part of an inner wall of the housing body 11. The first semiconductive tape 12 for heat dissipation includes a fluororesin base material 13 containing carbon black, and an adhesive layer 14 formed on the fluororesin base material 13. <P>COPYRIGHT: (C)2012,JPO&INPIT |
申请公布号 |
JP2012054001(A) |
申请公布日期 |
2012.03.15 |
申请号 |
JP20100193540 |
申请日期 |
2010.08.31 |
申请人 |
NITTO DENKO CORP |
发明人 |
TAGAWA KENICHI;TAKAYAMA YOSHINARI;NOMI SHUNSUKE |
分类号 |
H01M10/60;H01M2/10;H01M10/613;H01M10/651;H01M10/653;H01M10/6554 |
主分类号 |
H01M10/60 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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