SEMICONDUCTOR DEVICE, METHOD OF MANUFACTURING THE SAME, AND ELECTRONIC APPARATUS

摘要

PROBLEM TO BE SOLVED: To easily achieve an improvement in manufacturing efficiency, cost reduction, an improvement in reliability, and downsizing.

SOLUTION: A side surface of each of wiring 111h and 211h exposed at side end portions of a first semiconductor chip 100 and a second semiconductor chip 200 is coated with a conductive layer 401. For this reason, the both wiring 111h and 211h are electrically connected to each other by the conductive layer 401.

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