| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a manufacturing method of a semiconductor device in which a heat sink can be easily transported while preventing damages to an insulator layer. <P>SOLUTION: The semiconductor device manufacturing method comprises the steps of forming a heat sink 10 having grooves 12 or protrusions 34 on respective side faces, and forming an insulator layer 14 on a top face of the heat sink 10, transporting the heat sink 10 with a mechanical chuck 24 into a heated lower mold 28 by hooking the grooves 12 or the protrusions 34 of the heat sink 10 on which the insulator layer 14 is formed with hooks 26 of the mechanical chuck 24, mounting a frame 16 on which a power semiconductor element 18 is mounted on the insulator layer 14 of the heat sink 10 transported into the lower mold 28, and encapsulating a part of the heat sink 10, a part of the frame 16 and the power semiconductor element 18 with a mold resin 22 by pouring the mold resin 22 in the lower mold 28 and an upper mold 30. <P>COPYRIGHT: (C)2012,JPO&INPIT |
