| 摘要 |
<P>PROBLEM TO BE SOLVED: To handle extremely small spacer frames in a good manner and easily assemble individual parts in a method for manufacturing a CPS type solid image pickup device. <P>SOLUTION: An image sensor 10, a spacer frame with a holding part 12', and a cover glass 14 are individually produced and prepared. A space frame 12 is handled by sucking and holding a holding part 13a coupled to the spacer frame 12 with a suction handling tool. After the spacer frame 12 of the handled spacer frame with the holding part 12' and the cover glass 14 are positioned and bonded, the holding part 13a is removed. Subsequently, the image sensor 10 is positioned and bonded to the other surface of the spacer frame 12 having one surface on which the cover glass 14 is bonded. <P>COPYRIGHT: (C)2012,JPO&INPIT |
