发明名称 |
SEMICONDUCTOR CHIP DEVICE WITH UNDERFILL |
摘要 |
A method of manufacturing is provided that includes placing a removable cover on a surface of a substrate. The substrate includes a first semiconductor chip positioned on the surface. The first semiconductor chip includes a first sidewall. The removable cover includes a second sidewall positioned opposite the first sidewall. A first underfill is placed between the first semiconductor chip and the surface wherein the second sidewall provides a barrier to flow of the first underfill. Various apparatus are also disclosed.
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申请公布号 |
US2012061853(A1) |
申请公布日期 |
2012.03.15 |
申请号 |
US20100878812 |
申请日期 |
2010.09.09 |
申请人 |
SU MICHAEL Z.;FU LEI;REFAI-AHMED GAMAL REFAI-AHMED;BLACK BRYAN |
发明人 |
SU MICHAEL Z.;FU LEI;REFAI-AHMED GAMAL REFAI-AHMED;BLACK BRYAN |
分类号 |
H01L23/48;H01L21/66 |
主分类号 |
H01L23/48 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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