| 摘要 |
An LED lead frame comprises an insulative housing including a top surface, a bottom surface, and four side surfaces connected the top surface and the bottom surface, and a cavity recessed from the top surface. A pair of conductive leads each has a portion embedded into the insulative housing and another portion exposed out of the insulative housing. The another portion includes an end portion extending downwardly along one of the side surface, a bottom soldering portion extending continuously from the end portion along the bottom surface, and a pair of side soldering portions extending upwardly from two ends of the bottom soldering portion along another two opposite side surfaces. The bottom soldering portion and the side soldering portions can be used as an alternative mounting surface.
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