发明名称 |
SYSTEM AND METHOD TO REDUCE PRE-BACK-GRINDING PROCESS DEFECTS |
摘要 |
Processing defects arising during processing of a semiconductor wafer prior to back-grinding are reduced with systems and methods of sensor placement. One or more holes are bored into a chuck table for receiving semiconductor wafers, or a support table next to the chuck table. One or more sensors are disposed in the holes for monitoring parameters during a pre-back-grinding (PBG) process. A control box converts a set of signals received from the sensors. A computer-implemented process control tool receives the converted set of signals from the control box and determines whether the PBG process will continue. |
申请公布号 |
US2012065764(A1) |
申请公布日期 |
2012.03.15 |
申请号 |
US20100879278 |
申请日期 |
2010.09.10 |
申请人 |
LU CHEN-FA;CHEN CHENG-TING;HU JAMES;LIU CHUNG-SHI;TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. |
发明人 |
LU CHEN-FA;CHEN CHENG-TING;HU JAMES;LIU CHUNG-SHI |
分类号 |
G06F17/00 |
主分类号 |
G06F17/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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