HALBLEITERMODUL

摘要

The module (H) has a semiconductor component (2) e.g. diode, connected with an electrically insulative substrate (1) e.g. direct copper bonding, and surrounded by a housing (3). The housing is made of polymer material. The polymer material contains duroplast matrix formed from preceramic polymer. An intermediate space between the semiconductor component and the housing is partly filled with sealing compound (4). The preceramic polymer is filled with a filler material with a filling level of maximum 80 volume percentage.