| 发明名称 |
WAFER, METHOD FOR MANUFACTURING TEMPLATE SUBSTRATE FOR SEMICONDUCTOR LIGHT-EMITTING ELEMENT, METHOD FOR MANUFACTURING SEMICONDUCTOR LIGHT-EMITTING ELEMENT SUBSTRATE, TEMPLATE SUBSTRATE FOR SEMICONDUCTOR LIGHT-EMITTING ELEMENT, SEMICONDUCTOR LIGHT-EMITTING ELEMENT SUBSTRATE, AND RESIST COATING METHOD |
| 摘要 |
<P>PROBLEM TO BE SOLVED: To prevent the decrease in the patterning accuracy when forming unevenness on a surface of a wafer. <P>SOLUTION: The wafer 10 to be used as a semiconductor light-emitting element substrate includes an arcuate outer periphery 11, a first linear flat part 12 formed to a portion of the outer periphery 11, and a second linear flat part 13 connected to an end of the first flat part 12. <P>COPYRIGHT: (C)2012,JPO&INPIT |
| 申请公布号 |
JP2012051743(A) |
申请公布日期 |
2012.03.15 |
| 申请号 |
JP20100193757 |
申请日期 |
2010.08.31 |
| 申请人 |
SHOWA DENKO KK |
发明人 |
KAMEI KOJI |
| 分类号 |
C30B33/00;C30B29/20;H01L21/027;H01L33/32 |
主分类号 |
C30B33/00 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
|
| 地址 |
|
