发明名称 TEMPORARY FIXING SHEET FOR MANUFACTURING PROCESS OF ELECTRONIC PART
摘要 <P>PROBLEM TO BE SOLVED: To provide a temporary fixing sheet which firmly holds a ceramic sheet in a cutting step for the ceramic sheet and the like, also can provide high cutting accuracy, and then can efficiently and easily peel a chip from itself by being cooled to a predetermined temperature or lower, with a high degree of freedom in designing and adequate handleability. <P>SOLUTION: The temporary fixing sheet comprises a supporting substrate 1 and a temporary fixing layer 2 provided on at least one surface of the supporting substrate 1, wherein the temporary fixing layer 2 contains a urethane polymer and a vinyl polymer. <P>COPYRIGHT: (C)2012,JPO&INPIT
申请公布号 JP2012052038(A) 申请公布日期 2012.03.15
申请号 JP20100196251 申请日期 2010.09.01
申请人 NITTO DENKO CORP 发明人 SHIMOKAWA DAISUKE;SHIMAZAKI YUTA;NAGASAKI KUNIO;IMOTO EIICHI
分类号 C09J7/02;C09J133/00;C09J175/04;C09J175/14;H01G4/12;H01G4/30;H01G13/00 主分类号 C09J7/02
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