CIRCUIT BOARD, METHOD OF MANUFACTURING THE CIRCUIT BOARD, AND SEMICONDUCTOR DEVICE

摘要

PROBLEM TO BE SOLVED: To provide a circuit board having excellent workability of a via hole, a method of manufacturing the circuit board, and a semiconductor device.

SOLUTION: A method of manufacturing a circuit board 1 comprises the steps of: preparing a laminated plate in which an insulating layer 21 and a metal layer 11 that is formed on at least one surface of the insulating layer 21 and has a thickness of 2.0 μm or more to 12 μm or less are stacked; forming through holes 19 in the insulating layer 21 by irradiating the selectively removed portion with laser after the metal layer 11 is selectively removed; removing a desired thickness of the metal layer 11 by etching; and forming a conductive layer 15 on the metal layer 11 and the inner wall surfaces of the through holes 19.

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