发明名称 |
Printed circuit board having metal bumps |
摘要 |
A printed circuit board having a metal bump, including: an upper circuit layer including a circuit pattern embedded in an upper part of an insulating layer, the circuit pattern being made of electroconductive metal; wherein the metal bump is integrally formed with the circuit pattern and protruding from the circuit pattern and above the insulating layer.
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申请公布号 |
US2012061132(A1) |
申请公布日期 |
2012.03.15 |
申请号 |
US201113373388 |
申请日期 |
2011.11.14 |
申请人 |
KANG MYUNG SAM;PARK JEONG WOO;KIM OK TAE;YUN KIL YONG;SAMSUNG ELECTRO-MECHANICS CO., LTD. |
发明人 |
KANG MYUNG SAM;PARK JEONG WOO;KIM OK TAE;YUN KIL YONG |
分类号 |
H05K1/09;H05K1/02;H05K1/11 |
主分类号 |
H05K1/09 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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