COATING METHOD FOR AN OPTOELECTRONIC CHIP-ON-BOARD MODULE

摘要

The invention relates to a method for coating an optoelectronic chip-on-board module (1, 11-11'''). The optoelectronic chip-on-board module (1, 11-11''') comprises a flat support (2, 2') fitted with one or several optoelectronic components (4). The optoelectronic chip-on-board module (1, 11-11''') can have in particular at least one optics (23) which can encompass at least a primary optics (24) and, optionally, at least a secondary optics (25). In the method, the optoelectronic chip-on-board module (1, 11-11''') is coated with a transparent, UV- and temperature-resistant coating (12) made of a silicone. The method is characterized by the following method steps: a) casting a liquid silicone (21, 22) into a mould (20) which is open at the top and has external dimensions which correspond to or exceed the external dimensions of the support (2, 2'), b) introducing the support (2, 2') into the mould (20), wherein the optoelectronic component (4) or the optoelectronic components (4) are completely immersed in the silicone (21) and a surface of the support (2, 2') comes into contact with the entire surface of the silicone (21), or the support (2, 2') is at least partially immersed in the silicone (21), c) curing and cross-linking the silicone (21) with the optoelectronic components (4) and the support (2, 2'), and d) removing the support (2, 2') having the coating (12) from the cured silicone (21) from the mould (20).