| 摘要 |
<p>The purpose of the present invention is to provide a resin applying device of an LED package manufacturing system capable of making LED package light-emission characteristics uniform even if the light emission wavelengths of individual LED elements fluctuate, and enabling the improvement of production yield. Element characteristic information (12) obtained by pre-measuring the light emission characteristics of a plurality of LED elements individually, and resin application information (14), comprising suitable resin application amounts for obtaining an LED package having stipulated light emission characteristics associated with element characteristic information, are prepared beforehand. Map data (18), in which mounting position information (71a) that indicates positions on a substrate where LED elements were mounted by a component mounting device (M1) and element characteristic information (12) are associated, is created for each substrate by a map creation processing unit (74). On the basis of the map data (18) and the resin application information (14), a resin applying device (M4) applies a suitable application amount of resin to the LED elements mounted on the substrate.</p> |
