EINRICHTUNG UND VERFAHREN ZUR HERSTELLUNG EINER DOPPELSEITIGEN KAPSELUNG AUF SOI-WAFERMASSSTAB MIT DURCHKONTAKTIERUNGEN

摘要

A semiconductor package includes an SOI wafer having a first side including an integrated circuit system, and a second side, opposite the first side, forming at least one cavity. At least one chip or component is placed in the cavity. An optical through via is formed through a buried oxide which optically connects the chip(s) to the integrated circuit system.