| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an adhesive film that enables favorable implementation of a method of manufacturing a semiconductor device by which semiconductor chips with adhesive agent applied thereon can be yielded with efficiency and that can connect the semiconductor chips with a wiring substrate successfully. <P>SOLUTION: An adhesive film to serve as an adhesive agent layer 3 is hardened through compression and heating to connect a semiconductor chip 26 with a wiring substrate 40 and also electrically connect a wire 12 of the wiring substrate 40 with a projecting electrode 4 of the semiconductor chip 26. The adhesive film contains a resin composition containing a thermoplastic resin, a thermosetting resin, and a hardener, and filler. The adhesive film contains 20-100 pts.mass of the filler based on 100 pts.mass of the resin composition. When the adhesive film is heated at a temperature of 170-240°C for 5-20 seconds, a reaction rate of the adhesive film, which is calculated from heat generation measured with a DSC (Differential Scanning Calorimeter), is 50% or more. This adhesive film is favorably used with a method of manufacturing a semiconductor device. <P>COPYRIGHT: (C)2012,JPO&INPIT |
