发明名称 METHOD OF MANUFACTURING LIGHT-EMITTING DEVICE
摘要 <P>PROBLEM TO BE SOLVED: To provide a method of manufacturing a light-emitting device that can prevent adherence between a metal mold and heated glass with which a light-emitting device is glass-sealed by hot press processing. <P>SOLUTION: A method of manufacturing a light-emitting device comprises the steps of: disposing glass 4 at an element-mounted surface side of an Al<SB POS="POST">2</SB>O<SB POS="POST">3</SB>substrate on which an LED element 2 is mounted; disposing a metal thin plate 7 so that the metal thin plate 7 faces the opposite surface of the glass 4 to the Al<SB POS="POST">2</SB>O<SB POS="POST">3</SB>substrate 3; fusing the glass 4 onto the light-emitting element mounted surface of eth Al<SB POS="POST">2</SB>O<SB POS="POST">3</SB>substrate 3 by hot press processing using an upper metal mold 8 at the Al<SB POS="POST">2</SB>O<SB POS="POST">3</SB>substrate side and a lower metal mold 6 at the thin plate 7 side to seal the LED element 2 with the glass 4; and detaching the thin plate 7 adhering to the glass 4 after the glass 4 is cooled. <P>COPYRIGHT: (C)2012,JPO&INPIT
申请公布号 JP2012054270(A) 申请公布日期 2012.03.15
申请号 JP20100193277 申请日期 2010.08.31
申请人 TOYODA GOSEI CO LTD 发明人 YAMAGUCHI SEIJI
分类号 H01L33/52 主分类号 H01L33/52
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