| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a manufacturing method of an electronic element capable of insulating a wiring short circuit of the electronic element having an organic insulation layer, and the electronic element. <P>SOLUTION: After forming an organic insulation layer 12 on wiring layers 21 and 22, a short-circuit portion 23 of the wiring layers 21 and 22 is irradiated with a laser beam LB of a wavelength having transparency to the organic insulation layer 12 through the organic insulation layer 12, or a laser beam LB of a wavelength having transparency to a substrate 11 through the substrate 11. The short-circuit portion 23 disappears in a laser irradiation area 24, and insulation between the wiring layer 21 and the wiring layer 22 is recovered. The organic insulation layer 12 or the substrate 11 in contact with upper and lower sides of the short-circuit portion 23 are made to remain, and on the other hand, a cavity 25 is generated in the laser irradiation area 24 (a part where the short-circuit 23 disappears). <P>COPYRIGHT: (C)2012,JPO&INPIT |
