| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a wiring board in which the electrode of a semiconductor integrated circuit element and a conductor pillar can be connected rigidly and three-dimensionally, a sufficient interval can be kept between the lower surface of the semiconductor integrated circuit element and the upper surface of the wiring board even if the volume of solder joining them is small, and the gap therebetween can be filled well with sealing resin, and to provide a method of manufacturing the same. <P>SOLUTION: The wiring board comprises a semiconductor element connection pad 10 formed on the surface of an insulating substrate 3, a conductor pillar 12 formed on the semiconductor element connection pad 10, and a solder resist layer 6 which covers the side surface of the conductor pillar 12 and exposes the upper surface thereof. The conductor pillar 12 has a protrusion 12a which protrudes upward by 5-20 μm from the upper surface of the solder resist layer 6 in the center of the upper surface thereof. <P>COPYRIGHT: (C)2012,JPO&INPIT |
