| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a plasma etching chamber in which particle contamination is reduced. <P>SOLUTION: Components including a gas distribution plate 22, a chamber liner 30 and a focus ring 14 that constitute a plasma processing chamber 10 are subjected to surface plasma-splaying of ceramics or high temperature polymers having surface roughness properties to improve polymer adhesion for coating 32 thereof. By improving the polymer adhesion, the plasma sprayed component surfaces can reduce the levels of particle contamination in the process chamber, thereby improving yields and reducing down-time required for cleaning and/or replacing chamber components. <P>COPYRIGHT: (C)2012,JPO&INPIT |
