发明名称 |
METHOD OF MANUFACTURE OF INTEGRATED CIRCUIT PACKAGING SYSTEM WITH STACKED INTEGRATED CIRCUIT |
摘要 |
A method of manufacture of an integrated circuit packaging system includes: forming a base lead having an outer protrusion and an inner protrusion with a recess in between; forming a stack lead having an elongated portion; mounting a base integrated circuit over the inner protrusion or under the elongated portion; mounting the stack lead over the base lead and the base integrated circuit; connecting a stack integrated circuit and the stack lead with the stack integrated circuit over the base integrated circuit; and encapsulating at least a portion of both the base integrated circuit and the stack integrated circuit with the base lead and the stack lead exposed.
|
申请公布号 |
US2012064668(A1) |
申请公布日期 |
2012.03.15 |
申请号 |
US201113300088 |
申请日期 |
2011.11.18 |
申请人 |
CAMACHO ZIGMUND RAMIREZ;PISIGAN JAIRUS LEGASPI;BATHAN HENRY DESCALZO |
发明人 |
CAMACHO ZIGMUND RAMIREZ;PISIGAN JAIRUS LEGASPI;BATHAN HENRY DESCALZO |
分类号 |
H01L21/56 |
主分类号 |
H01L21/56 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|