| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a mounting structure of an RFIC chip, capable of obtaining an RFIC device having high reliability by suppressing stress applied to the RFIC chip. <P>SOLUTION: An RFIC module 101 is formed by mounting an RFIC chip 40 on a mounting substrate 70 and sealing the RFIC chip 40 with a sealing resin layer 71. The mounting substrate 70 is composed of flexible base materials 50, 60, and various electrodes formed in these flexible base materials. Multiple external terminals 41, 42, 43, 44 are provided in the vicinity of four corners of a mounting surface of the RFIC chip 40. A mounting land 52 among multiple mounting lands on the surface of the flexible base material 50 is a common mounting land which is integrated as a mounting land common to an RF terminal 42 and an NC terminal 44 of the RFIC chip 40. The common mounting land 52 is arranged so as to cover one side 40S2 of the RFIC chip 40 in a plan view. <P>COPYRIGHT: (C)2012,JPO&INPIT |
