发明名称 PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE RESIN VARNISH, PHOTOSENSITIVE RESIN FILM, PHOTOSENSITIVE RESIN CURED PRODUCT AND LIGHT GUIDE PATH FOR VISIBLE LIGHT
摘要 <P>PROBLEM TO BE SOLVED: To provide a photosensitive resin composition that gives a cured product having high transparency in a visible light wavelength region of 380 nm to 780 nm and excellent reliability in a high temperature and high humidity environment, and to provide a photosensitive resin varnish, a photosensitive resin film, a photosensitive resin cured product of the composition, and a light guide path for visible light formed of the cured product. <P>SOLUTION: The photosensitive resin composition contains (A) an acrylic polymer, (B) a polymerizable compound, (C) a photopolymerization initiator and (D) a hindered phenol-based antioxidant. The (B) polymerizable compound is a polyfunctional polymerizable compound having two or more polymerizable substituents in one molecule. <P>COPYRIGHT: (C)2012,JPO&INPIT
申请公布号 JP2012053229(A) 申请公布日期 2012.03.15
申请号 JP20100195075 申请日期 2010.08.31
申请人 HITACHI CHEM CO LTD 发明人 MUKAI IKUO;TAKASAKI TOSHIHIKO;MITANI IKUE;OCHIAI MASAMI;NAKAMURA TAKESHI;TAKAHASHI ATSUSHI
分类号 G03F7/004;C08F2/44;C08F2/50;G03F7/027;G03F7/033 主分类号 G03F7/004
代理机构 代理人
主权项
地址