| 摘要 |
A molding apparatus for packaging a semiconductor device includes an upper mold having a first cavity, a lower mold having a second cavity corresponding to the first cavity, and a selective flow facilitation unit. The first and second cavities are configured to receive a printed circuit board (PCB). The selective flow facilitation unit is configured to increase a flow of a molding resin in a selective area of the PCB. The flow of the molding resin in the selective area of the PCB is faster than the flow of the molding resin in a non-selective area of the PCB.
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