| 摘要 |
PURPOSE: A resin composition for a no-flow underfill, and a no-flow underfill film using thereof are provided to secure the excellent crack resistance of the underfill film, and to rapidly hardening the composition at the soldering process temperature. CONSTITUTION: A resin composition for a no-flow underfill contains the following: 100 parts of epoxy resin by weight; 5~80 parts of thermally depolymerizable resin by weight containing an acid catalyst; 1~110 parts of hardener and curing accelerator by weight; 3~80 parts of modifying thermoplastic resin by weight; and 0.01~0.10 parts of fusion material by weight. |
