| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor package having an excellent drop impact resistance. <P>SOLUTION: A semiconductor package 1 has: a package substrate 7 having a core layer 9 containing an insulating resin; at least one semiconductor element 5 mounted on the package substrate and whose circumference is sealed by a sealing material 6; and a solder bump 4 as a connection electrode for connecting the package substrate with a mother board 2. In the semiconductor package 1, a characteristic value A of the insulating resin, which is represented by the following formula (1), is 1.4 MPa or less. In the formula (1), T1 is a sealing temperature (°C), T2 is a melting point (°C) of the solder bump, E<SB POS="POST">T2</SB>is an elastic modulus (MPa) of the insulating resin at the melting point of the solder bump, and α (T) is a thermal expansion coefficient (°C<SP POS="POST">-1</SP>) of the insulating resin at T°C. <P>COPYRIGHT: (C)2012,JPO&INPIT |
