发明名称 PRESSURE SENSITIVE ADHESIVE TAPE
摘要 <P>PROBLEM TO BE SOLVED: To provide a pressure sensitive adhesive tape, having a good thermal conductivity. <P>SOLUTION: This adhesive tape is equipped with a substrate material layer comprising a plastic material etc., and a pressure sensitive adhesive layer installed on at least one of the surfaces of the substrate material layer. The pressure sensitive adhesive tape has <2.00 [cm<SP POS="POST">2</SP>K/W] thermal resistance value at 80&deg;C, and <10 &mu;m total thickness of the substrate layer and the pressure sensitive adhesive layer. Also, the pressure sensitive adhesive layer may be installed on the both sides of the substrate material layer. Also, the total thickness of the substrate material layer and the pressure sensitive adhesive layer may be <6 &mu;m. <P>COPYRIGHT: (C)2012,JPO&INPIT
申请公布号 JP2012052099(A) 申请公布日期 2012.03.15
申请号 JP20110158934 申请日期 2011.07.20
申请人 NITTO DENKO CORP 发明人 SOEDA YOSHIKAZU;SADASHI KENTA;YOSHIDA SHO;MIZUTORI TAKAHISA;SUZUKI SHUNEI
分类号 C09J7/02;C09J11/04;C09J201/00;H05K7/20 主分类号 C09J7/02
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