| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor manufacturing method that can improve yield and reliability by inhibiting slip occurrence at temperature drop after wafer deposition. <P>SOLUTION: The semiconductor manufacturing method comprises the steps of transferring a wafer into a reaction chamber to load the wafer on a support member, supplying process gasses including a source gas on a surface of the wafer, depositing the surface of the wafer by heating the wafer to a predetermined temperature by controlling output of a heater with rotating the wafer at a first revolution speed, stopping supply of the source gas to reduce the revolution speed to a second revolution speed that can keep offset balance of the wafer, and stopping the output of the heater to drop a temperature of the wafer with rotating the wafer at the second revolution speed. <P>COPYRIGHT: (C)2012,JPO&INPIT |
