| 摘要 |
An apparatus and a method configured to lower thermal stress is disclosed. One embodiment provides a semiconductor chip, a heat sink plate and a layer structure. The layer structure includes at least a diffusion solder layer and a buffer layer. The layer structure is arranged between the semiconductor chip and the heat sink plate. The buffer layer includes a material, which is soft in comparison to a material of the diffusion solder layer, and includes a layer thickness such that thermal stresses in the semiconductor chip remain below a predetermined value during temperature fluctuations within a temperature range.
|
