发明名称 |
INTEGRATED CIRCUIT PACKAGING SYSTEM WITH PACKAGE-ON-PACKAGE AND METHOD OF MANUFACTURE THEREOF |
摘要 |
A method of manufacture of an integrated circuit packaging system includes: providing a bottom substrate; mounting a bottom integrated circuit over the bottom substrate; mounting a top substrate over a side of the bottom integrated circuit opposite the bottom substrate; connecting a top interconnect between the bottom substrate and the top substrate; and forming an underfill layer between the bottom substrate and the top substrate, the underfill layer encapsulating the top interconnect outside a perimeter of the bottom integrated circuit.
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申请公布号 |
US2012061854(A1) |
申请公布日期 |
2012.03.15 |
申请号 |
US20100881983 |
申请日期 |
2010.09.14 |
申请人 |
CHOW SENG GUAN;GOH HIN HWA;HUANG RUI;KUAN HEAP HOE |
发明人 |
CHOW SENG GUAN;GOH HIN HWA;HUANG RUI;KUAN HEAP HOE |
分类号 |
H01L23/48;H01L21/60 |
主分类号 |
H01L23/48 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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