| 发明名称 |
FILM FOR SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE |
| 摘要 |
<p>Provided is a film for a semiconductor device, wherein an adhesive film with a dicing sheet, which is an adhesive film laminated on top of a dicing film, is laminated to a cover film at prescribed intervals. Said film for a semiconductor device is capable of suppressing the formation of transfer marks on the adhesive film, when the film for a semiconductor device is wound into a roll. The film for a semiconductor device of the present invention is a film for a semiconductor device wherein the adhesive film with a dicing sheet, which is the adhesive film laminated on top of the dicing film, is laminated to the cover film at prescribed intervals, and said film for a semiconductor device has a Ta/Tb ratio between the cover film thickness (Ta) and the dicing film thickness (Tb) of 0.07-2.5.</p> |
| 申请公布号 |
WO2012032959(A1) |
申请公布日期 |
2012.03.15 |
| 申请号 |
WO2011JP69473 |
申请日期 |
2011.08.29 |
| 申请人 |
NITTO DENKO CORPORATION;AMANO,YASUHIRO;INOUE,KOICHI |
发明人 |
AMANO,YASUHIRO;INOUE,KOICHI |
| 分类号 |
H01L21/301;B32B7/06;H01L21/52;H01L21/683 |
主分类号 |
H01L21/301 |
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