<p>A sputtering apparatus (1) for forming a thin film on a substrate (S) disposed in a film-forming space (2S) is provided with: a plurality of targets (13A to 13C); and shutter mechanisms (M) which are disposed between the targets (13A to 13C) and the film-forming space (2S) and have openings (22) that expose a selected target to the film-forming space (2S). The shutter mechanisms (M) are provided with injection control units (30A to 30C) that control the number of sputtering particles released from the selected target toward a substrate outer peripheral section (S2). The plurality of injection control units have a plurality of shielding levels with respect to the sputtering particles. An injection control unit that is suitable for the selected target is used from among the plurality of injection control units in accordance with the film thickness distribution when the selected target that is exposed to the film-forming space (2S) is individually sputtered.</p>
