ANWENDUNG EINER TRANSPARENTEN LEUCHTDIODENANZEIGEVORRICHTUNG IN EINEM KRAFTFAHRZEUG

摘要

A method of fabrication of transparent LED devices, of the type comprising the operations of: i) providing a series of conductive paths (16, 20 30) on a transparent underlayer (15); ii) connecting said conductive paths to electronic control means; iii) associating to said underlayer 15 an array of LED sources addressable individually or in groups through said conductive paths, in which i) said LED sources are integrated in the form of chips, i.e., of elements obtained by dividing up a semiconductor wafer and without package, via technologies of the chip-on-board type; ii) said method envisages the use of the flip-chip technique for die bonding, i.e., the electrical connection of the chip (10) to the underlayer.