| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an LED device provided with a dam material, which can solve the problem occurring when disposing a reflection member such as a white resist, a silicon resin or the like in a region surrounded by the dam material such that it is necessary to apply photolithography or a printing method of high location accuracy. <P>SOLUTION: A reflective silicon resin 21 is coated by flow coating on a bottom part of a region surrounded by a dam material 11. At this time, a top face of the reflective silicon resin 21 is lower than a top face of an LED 22. It is favorable that a thickness of the reflective silicon resin 21 is approximately 30-50 μm. <P>COPYRIGHT: (C)2012,JPO&INPIT |
