METHOD AND DEVICE FOR MEASURING THE RELIABILITY OF AN INTEGRATED CIRCUIT

摘要

Electromigration may cause a fault to appear in an integrated circuit located on a semiconductor chip. To detect such a fault, at least one resistive test structure is provided separated from the integrated circuit and located on at least one metallization level of the integrated circuit. During operation of the integrated circuit, the resistive test structure is sensed. Detection of a voltage difference between two points of the resistive test structure is indicative of a fault.