发明名称 |
SUBSTRATE, SUBSTRATE PRODUCTION METHOD AND SAW DEVICE |
摘要 |
<p>A substrate is obtained that has suitable strength at low cost, and can tightly bond with a component such as a piezoelectric material substrate. The present invention is a SAW device substrate (1) comprising spinel, wherein the level difference PV value of one of the main surfaces (1a) of the substrate (1) is no less than 2 nm and no more than 8 nm. The value of average roughness Ra of the one main surface (1a) of the substrate (1) is preferably no less than 0.01 nm and no more than 0.5 nm. Accordingly, the main surface (1a) that bonds with the piezoelectric material substrate of the SAW device on the substrate (1) can bond satisfactorily with the piezoelectric material forming the piezoelectric materialsubstrate using van der Waals force.</p> |
申请公布号 |
WO2012033125(A1) |
申请公布日期 |
2012.03.15 |
申请号 |
WO2011JP70375 |
申请日期 |
2011.09.07 |
申请人 |
SUMITOMO ELECTRIC INDUSTRIES, LTD.;TSUJI, YUTAKA;NAKAYAMA, SHIGERU |
发明人 |
TSUJI, YUTAKA;NAKAYAMA, SHIGERU |
分类号 |
H03H3/08;C04B35/443;H03H3/02;H03H9/145;H03H9/17;H03H9/25 |
主分类号 |
H03H3/08 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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