| 摘要 |
<p>A wafer conveying method is provided with: a step which, in order to produce a gap between any adjacent wafers (90) among wafers (90) stacked on one another in liquid, discharges the liquid toward the end surfaces of the wafers (90); and a step which picks up at least the uppermost-located wafer (90) among the wafers (90) with the gap produced. The configuration enables the wafers (90) to be separated one by one without using manpower after cutting, for example, by wire saws.</p> |
