| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a phenol resin composition which can be preferably used as a curing agent for an epoxy resin in a curable resin composition which imparts a cured product with superior heat resistance and flame retardance and superior in interlaminar bond strength in using as a printed-circuit board. <P>SOLUTION: The phenol resin composition is obtained by reacting a compound (a2) represented by general formula (2) [wherein R<SP POS="POST">1</SP>and R<SP POS="POST">2</SP>are each independently a hydrogen atom, alkyl, or alkoxy], and formaldehyde (f) in the presence of an acid catalyst to obtain a product having 115-150°C of a softening point, and having 1-6% of the remaining content of the compound (a2) based on the peak area of a GPC measurement. <P>COPYRIGHT: (C)2012,JPO&INPIT |
