| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a technique that can suppress decrease in throughput of a coating and developing device and suppress a device installation area. <P>SOLUTION: A processing block has a block of a heating system at a carrier block side, a unit block group of a liquid processing system, and a heating block at an interface block side which are disposed in this order from the carrier block side to the interface block side. The unit block group of the liquid processing system comprises a coating film unit block group in which an antireflection film unit block, a resist film unit block and an upper layer film unit block are laminated in this order on the upper side, and a developing unit block which is laminated on the coating film unit block group vertically. A liquid processing module in the each unit block of the liquid processing system is disposed at both the right and left sides of a feeding passage of a substrate. <P>COPYRIGHT: (C)2012,JPO&INPIT |
