| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor device that can inhibit increase of the semiconductor device in size, though having a structure of laminated chips connected by wires. <P>SOLUTION: A semiconductor device 200 comprises: a wiring board 1 having connection pads 15 on one face; a plurality of semiconductor chips laminated in a stepwise manner on the one face of the wiring board 1 and having circuits and electrode pads 19 provided on every surfaces; wires 17 connecting the electrode pad 19 or the connection pad 15 with the connection pad 15 on the neighboring semiconductor chip in a stepwise manner; and first electrode pads 19a and second electrode pads 19b each connected with a circuit on its own semiconductor chip and relay pads 19c independent from the circuits, the pads 19a, 19b, 19c being provided on each stepped portion in an arrangement order same with each other. The first electrode pads 19a are commonly connected to be connected to the connection pad 15. The second electrode pad 19b is connected to the connection pad 15 via more than one relay pads 19c. <P>COPYRIGHT: (C)2012,JPO&INPIT |
