发明名称 |
BACK SIDE PROTECTIVE STRUCTURE FOR A SEMICONDUCTOR PACKAGE |
摘要 |
A back side protective structure for a semiconductor package provided with a conductive layer, which is elastic and contains conductive material, formed between a protection substrate and an adhesive layer for having the protection substrate more stably fixed on the semiconductor package and protecting the back side of the semiconductor package. |
申请公布号 |
US2012061830(A1) |
申请公布日期 |
2012.03.15 |
申请号 |
US201113298819 |
申请日期 |
2011.11.17 |
申请人 |
HU YU-SHAN;WEI SHIH-CHUAN;HU DYI-CHUNG |
发明人 |
HU YU-SHAN;WEI SHIH-CHUAN;HU DYI-CHUNG |
分类号 |
H01L23/498 |
主分类号 |
H01L23/498 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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