| 摘要 |
The method for producing a semiconductor module (10) having two semiconductor chips (12, 14) and an interposer (20), which has electrically conductive structures (28) that connect the semiconductor chips to each other, comprises imprinting the interposer directly on a first one of the semiconductor chips, generating the electrically conductive structures by electrically conductive ink during imprinting the interposer, and installing the second semiconductor chip on the interposer such that the two semiconductor chips are arranged on top of each other. The method for producing a semiconductor module (10) having two semiconductor chips (12, 14) and an interposer (20), which has electrically conductive structures (28) that connect the semiconductor chips to each other, comprises imprinting the interposer directly on a first one of the semiconductor chips, generating the electrically conductive structures by electrically conductive ink during imprinting the interposer, and installing the second semiconductor chip on the interposer such that the two semiconductor chips are arranged on top of each other and the interposer forms an intermediate layer between the two semiconductor chips. The electrically conductive ink is oozed by a jet for generating the electrically conductive structures. The electrically conductive structures are generated using an aerosol jet printing process. The imprinting step comprises imprinting an electrically insulated layer with recesses directly on the first semiconductor chip and spraying the electrically conductive ink on the electrically conducting layer using the jet. The electrically insulated layer is imprinted on the semiconductor chip per screen printing. During the imprinting step, the electrically conductive ink is directly sprayed on the first semiconductor chip using the jet. The electrically conductive ink has metallic particles with a maximum dimension of 20 nm, and contains silver, gold and/or copper particle, where the metallic particles bind at a temperature of below 200[deg] C and with a wavelength of less than 600 nm during the irradiation of light. The first semiconductor chip is a part of the wafer during imprinting the interposer. The wafer is isolated after imprinting the interposer. The wafer is tested at defective areas during imprinting the interposer and the layout of the electrically conductive structures to be imprinted is configured on the basis of the test results by avoiding the defective areas. Independent claims are included for: (1) a semiconductor module; and (2) an arrangement for producing a semiconductor module. |
