SUBSTRATE RECEIVING DEVICE SUBSTRATE THERMOCOMPRESSION BONDING DEVICE

摘要

A substrate receiving device (3) loads and retains a rigid substrate (6), and receives pressure during a thermocompression bonding operation of a flexible substrate (8). The substrate receiving device (3) comprises a sheet-shaped receiving plate (4) whereupon a receiving support surface (4a) is disposed which makes contact with, and supports, the lower face of the rigid substrate (6). An aperture part (4d) is disposed on the receiving support surface (4a), said aperture part (4d) being open in a plan shape and containing compression regions of the rigid substrate (6) and the flexible substrate (8). A receiving member (5) is disposed in the aperture part (4d) which, during the thermocompression operation, makes contact with the lower face of the rigid substrate (6) and pre-mounted components (6c) that are previously mounted in the compression region on said lower face, said receiving member (5) applying an upward-facing supporting resistance in response to pressure.