DESIGN METHOD OF MULTILAYER PRINTED CIRCUIT BOARD AND MULTILAYER PRINTED CIRCUIT BOARD

摘要

A design method of a multilayer printed circuit board (PCB) and a multilayer PCB. The method comprises the following steps: step A: disposing, on a multilayer PCB, multiple ball grid array (BGA) pads for connecting component pins; step B: selecting at least one non-lead pad from the multiple BGA pads; step C: using a common punching process to open, on the non-lead pad, via holes (20) for connecting other GBA pads. The design method of a multilayer PCB guarantees reliable connection of the PCB while reducing costs significantly.