| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a method for forming a thinned conductive pattern on a substrate surface with high adhesion without carrying out liquid-repellent treatment. <P>SOLUTION: The method for forming a conductive pattern is characterized by comprising the steps of: forming a compound layer having a group capable of being bound to a metal, on a substrate surface; applying a metal-nano-particle dispersion ink to a compound layer surface in a pattern shape while heating the compound layer surface, to form a metal-nano-particle dispersion ink layer; and sintering the metal-nano-particle dispersion ink layer. <P>COPYRIGHT: (C)2012,JPO&INPIT |
