发明名称 THIN-WALLED MOLDED FORM FOR ELECTRONIC EQUIPMENT HOUSING
摘要 <P>PROBLEM TO BE SOLVED: To provide a thin-walled molded form having a high mechanical strength and causing a small dimensional change by water absorption, and a production method thereof. <P>SOLUTION: This thin-walled molded form is a thin-walled molded form obtained from a resin composition containing a resin-impregnated fiber bundle produced by a method including: impregnating a bundle of a glass long fiber with a polyamide in a molten state to integrate them; and cutting the resultant integrate into a length of 5 to 15 mm in which the polyamide is a polyamide obtained from an aromatic dicarboxylic acid and an aliphatic diamine or from an aliphatic dicarboxylic acid and an aromatic diamine and the content of the glass fiber in the resin-impregnated fiber bundle is 40 to 70 mass%, and which satisfies the requirements (a) to (d): (a) the thickness is 0.8 to 2.0 mm; (b) the weight average fiber length of the glass fiber is 0.5 to 1.5 mm; (c) the Charpy impact strength is 10 kJ or more; and (d) the moisture absorption value based on the absolute dry value (100%) of the flexural modulus (a test piece of length 80 mm&times;width 10 mm&times;thickness 2 mm) is 80% or more. <P>COPYRIGHT: (C)2012,JPO&INPIT
申请公布号 JP2012052093(A) 申请公布日期 2012.03.15
申请号 JP20110104879 申请日期 2011.05.10
申请人 DAICEL POLYMER LTD 发明人 KATAYAMA MASAHIRO;ASAMI YOSHIHIRO
分类号 C08J5/04 主分类号 C08J5/04
代理机构 代理人
主权项
地址