| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a method of clearly measuring the magnitude and direction of internal stress of resin mold parts. <P>SOLUTION: In order to measure internal stress of a resin mold part 1 composed of a semiconductor element 2 sandwiched between two metal plates 3, 3 and molded with a thermosetting resin 5, rubber balls 11, 11... that are deformed by external force and has heat resistance at the thermal hardening temperature of the thermosetting resin 5 are molded with resin while the rubber balls 11, 11... are disposed between metal plates 3, 3, and the magnitude and direction of principal stress applied to the rubber balls 11 are measured by detecting the deformation state of each rubber ball 11 with a non-destructive inspection, so as to measure internal stress at the position where the rubber balls 11, 11... are disposed. <P>COPYRIGHT: (C)2012,JPO&INPIT |
