发明名称 |
Electronic Packaging With A Variable Thickness Mold Cap |
摘要 |
An electronic package with improved warpage compensation. The electronic package includes a mold cap having a variable thickness. The variable thickness can have a mound or dimple design. In another embodiment, a method is provided for reducing unit warpage of an electronic package by designing the topography of a mold cap to compensate for warpage.
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申请公布号 |
US2012061857(A1) |
申请公布日期 |
2012.03.15 |
申请号 |
US20100881549 |
申请日期 |
2010.09.14 |
申请人 |
RAMADOSS VIVEK;JHA GOPAL C.;HEALY CHRISTOPHER J.;QUALCOMM INCORPORATED |
发明人 |
RAMADOSS VIVEK;JHA GOPAL C.;HEALY CHRISTOPHER J. |
分类号 |
H01L23/28;H01L21/50;H01L21/56 |
主分类号 |
H01L23/28 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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