COMPOSITION WITH HIGH HEAT-RESISTANT AND LOW DIELECTRIC CONSTANT AND SUBSTRATE USING THE SAME

摘要

PURPOSE: A composite material composition and a substrate using thereof are provided to improve thermal resistance and lower dielectric property by including high thermal resistant epoxy resin and hardener. CONSTITUTION: A composite material composition comprises 14-34 weight% of inorganic filler including hollow glass microsphere which concurrently controls low dielectric property and high thermal resistance property, 31-51 weight% of epoxy based adhesive which controls adhesive force and high thermal resistance property of the tape, 23-43 weight% of acid anhydride based hardener which controls the high thermal resistance property through curing reaction with the adhesive of acid anhydride, and 0.1-0.3 weight% of curing accelerator which controls the thermal characteristic and curing reaction of the tape.